Advanced Dual-Beam System for Sample Preparation, Imaging and Analysis:
Model: Helios Nanolab 600; FEI Netherlands
The Dual Beam System combines the electron column for high-resolution, high-contrast imaging with the high-performance ion column for fast, precise cross milling. The electron gun is Schottky thermal field emitter. The system has high-resolution imaging capability with SEM resolution 0.9 nm and 0.8 nm STEM resolution. Ion source is Gallium liquid metal. The Ion Beam voltage of 500 V - 30 kV. The ion column's ability to maintain small beam diameter at less than 1 kV enables low-energy, grazing-incidence final clean-up to remove surface damage induced by higher-energy milling.
It has Gas Injection System (GIS) for precise deposition of Platinum.
It also includes in-situ sample lift-out system Omniprobe for TEM sample preparation and other manipulations.
Electron Beam Lithography kits from Nabity is installed in this system.
High precision 5-axes motorized stage.
XY: 150 mm, piezo-driven; Z: 10 mm motorized; T: -10° to +60° Tilt accuracy (between 50° to 54°): 0.1°; R: 360°, piezo-driven.
It also includes in-situ sample lift-out system Omniprobe for TEM sample preparation and other manipulations.
Electron Beam Lithography kits from Nabity is installed in this system.
High precision 5-axes motorized stage.
XY: 150 mm, piezo-driven; Z: 10 mm motorized; T: -10° to +60° Tilt accuracy (between 50° to 54°): 0.1°; R: 360°, piezo-driven.